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ZedLabz

APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz

Name: APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
Brand: ZedLabz
SKU: 700514
Price: 6300.0 GBP
Availability: OutOfStock

$6.300

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Features:

- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.

Description:

A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.