Home > Products > APU GPU BGA reballing Stencil set for...
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Description
Features:
- Direct heat rework template for Nintendo Wii GPU CPU BGA. - Includes 4 pieces. - For 0.6 solder balls (0.50mm for CPU). - Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
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