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APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
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- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.Ā
| Platform | Nintendo Wii |
|---|---|
| Colour | Silver |
| Manufacturer | ZedLabz |
| EAN | 5056026434393 |
| Weight | 15g |
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